Syenta, located in Sydney, is seeking a skilled professional for substrate IC package design, focusing on advanced packaging technologies. The ideal candidate has a Bachelor’s or Master’s degree in Electrical Engineering and over 5 years of experience in high-performance substrate designs. Responsibilities include designing complex interposers and ensuring robust signal integrity. The position offers a hybrid work workplace, competitive salary between $130,000 and $180,000, and opportunities for professional growth in a dynamic startup culture.
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📌 Senior Substrate IC Package Design Engineer (Hybrid, Sydney) (City of Sydney)
🏢 Syenta
📍 City of Sydney
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