Postdoc: Advanced RF Packaging (Sydney)

Postdoc: Advanced RF Packaging (Sydney)

13 Nov
|
Centre For Continuing Education
|
Sydney

13 Nov

Centre For Continuing Education

Sydney

The University of Sydney's School of Electrical and Computer Engineering invites applications for a Postdoctoral Research Associate/Fellow (Level A or B) to advance microwave technologies for microelectronics and system-in-package.

You will design packaging, perform modelling, develop hardware, collaborate with industry, supervise students and publish outcomes in high-impact journals.

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📌 Postdoc: Advanced RF Packaging (Sydney)
🏢 Centre For Continuing Education
📍 Sydney

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