The University of Sydney's School of Electrical and Computer Engineering invites applications for a Postdoctoral Research Associate/Fellow (Level A or B) to advance microwave technologies for microelectronics and system-in-package.
You will design packaging, perform modelling, develop hardware, collaborate with industry, supervise students and publish outcomes in high-impact journals.
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📌 Postdoc: Advanced Rf Packaging & Terahertz Imaging (Sydney)
🏢 Times Higher Education
📍 Sydney
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