Syenta is pioneering Localized Electrochemical Manufacturing (LEM) for advanced packaging interconnects. The role focuses on diagnosing failed copper deposits, designing experiments to pinpoint causes, and turning results into repeatable recipes for production-scale plating systems.
You will work with process and equipment engineers to ensure the plating systems meet specifications, improve yield, and scale lab results to manufacturing environments. A hands-on, quick-moving approach is essential.
📌 Copper Electrodeposition Engineer for Advanced Packaging (Sydney)
🏢 Syenta
📍 Sydney
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