The University of Sydney’s School of Electrical and Computer Engineering invites applications for a Postdoctoral Research Associate/Fellow (Level A or B) to contribute to research on advanced microwave technologies for microelectronics and system-in-package.
You will design and test semiconductor packaging, implement electromagnetic modelling with ADS/CST/HFSS, and collaborate with industry partners to deliver high-frequency imaging platforms.
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📌 Postdoc: mmWave & Terahertz Imaging System Integration (Sydney)
🏢 The University of Sydney
📍 Sydney
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