Postdoctoral Rf & Microwave Packaging Fellow (Sydney)

Postdoctoral Rf & Microwave Packaging Fellow (Sydney)

03 Nov
|
University Of Sydney
|
Sydney

03 Nov

University Of Sydney

Sydney

The University of Sydney invites applications for a Postdoctoral Research Associate/Fellow (Level A or B) in the School of Electrical and Computer Engineering to advance microwave technologies for microelectronics and RF system-in-package.
You will design, simulate and validate high-frequency systems, collaborating with industry partners and researchers to drive impactful outcomes.
This role offers extension possibilities and involves supervising students, publishing results and contributing to
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📌 Postdoctoral Rf & Microwave Packaging Fellow (Sydney)
🏢 University Of Sydney
📍 Sydney

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