Mixed-Signal ASIC Lead
(Full Australian working rights required)
$*******k + super + equity
Take diamond-based quantum sensing into its first product ASIC:
An early-stage deep tech company is turning diamond-based quantum sensing into compact devices for real-world deployment
The research chip exists, and its limitations have been investigated
Customer demand is bringing the next chip's development forward alongside field trials
You'll join as the first dedicated chip specialist, owning the external design partnership and helping deliver the first product ASIC
The opportunity goes beyond a smaller sensor:
Integrating diamond-based sensing with custom silicon creates more ways to embed magnetic measurement into equipment
Smaller devices can be deployed in arrays and networks, measuring changes across a wider area
Applications include navigation where GPS is unavailable and detecting magnetic anomalies across distributed sensors
Your engineering decisions will help determine how that capability becomes a practical commercial product
You'll own a close technical partnership:
Become the primary technical contact for an external chip design team that works as an extension of the business
Build on an established, positive relationship, setting requirements and challenging assumptions with evidence
Report to the Product and Engineering Lead and work closely with hardware and firmware engineers
Connect design decisions to product requirements and partner needs
Your remit runs from specification to measured silicon:
Define CMOS requirements and manage outsourced design and characterisation through to tape-out




Review simulations against specifications and bring up first silicon, including packaged parts and bare die
Characterise noise, linearity, bandwidth, power and photosensor performance across temperature and supply conditions
Correlate measurements with simulation, automate repeatable tests and feed findings into the next design
Develop test interfaces, including package/PCB layout, needle probing and probe cards
Support ASIC integration, FPGA controller programming and migration of FPGA functions into future CMOS/SoC designs
Success means taking ownership, then shaping what comes next:
First six months:
Understand the current chip in depth and take responsibility for the design-partner relationship
As the programme approaches tape-out:
Use your understanding of target markets and partner needs to guide future chip and peripheral improvements
Throughout:
Give the wider team transparent technical recommendations grounded in measured performance
You'll bring experience you can explain at the bench:
Around five to ten years in mixed-signal ASIC design, including photosensor design or validation
Experience taking a chip from specification to measured silicon, with a clear account of your contribution.
Confidence investigating differences between simulation and bench results.
The judgement to challenge a design partner and explain trade-offs to colleagues across disciplines.
A willingness to get into the lab and work through the problem yourself.
The team and the practicalities:
A small, collaborative engineering team where your specialist judgement will be visible and relied upon
Hands-on lab work, with flexibility
Full Australian working rights required

📌 Mixed-Signal Asic Lead (New South Wales)
🏢 The Onset Group
📍 New South Wales