Senior Process Engineer: Advanced Packaging & Interconnect

NoiseFigure Research is seeking a Senior Process Engineer, Advanced Packaging & Interconnect Materials to lead hands-on process development, optimization, and validation for advanced microelectronics packaging, wafer-level interconnects, electronic materials, and next-generation wearable technology applications.

This role focuses on advancing existing proof-of-concept processes into repeatable, measurable, and reliable engineering workflows. The position requires extensive hands-on experience in wafer-level microfabrication, polymer dielectric processing, printed metal interconnects, wafer and die bonding, materials characterization, custom tooling, and reliability testing.

The Senior Process Engineer will independently manage technical development activities, including experimental planning, equipment operation, process optimization, test vehicle development, metrology, statistical analysis, and technical documentation. The position requires advanced engineering judgment, minimal technical ramp-up, and accountability for achieving customer specifications, project milestones, and documented technical deliverables.

Key Responsibilities

- Develop, optimize, and validate coupon- and wafer-level (100-200 mm) advanced packaging processes, including stencil and screen printing, metal ink and paste sintering, polymer dielectric processing, lithography, physical vapor deposition (PVD), electroplating, and wafer/die bonding.
- Develop polymer dielectric and interconnect processes involving spin coating, dry-film lamination, laser or photolithographic via formation, curing, thermocompression bonding, and polymer adhesive bonding.
- Design and execute structured experiments, DOE activities,



process-window studies, and statistical analyses to improve electrical performance, bond strength, yield, repeatability, and manufacturability.
- Design, fabricate, and evaluate electrical and mechanical test vehicles, including daisy-chain structures, Kelvin structures, and shear/pull samples, to characterize interconnect resistance, adhesion, bonding quality, and process performance.
- Design and fabricate custom fixtures, alignment jigs, printing and lamination tools, hot-press fixtures, and mechanical test fixtures using CAD, 3D printing, machining, and external fabrication resources.
- Evaluate metal inks, pastes, polymer dielectrics, adhesives, and substrate materials through rheology, particle-size analysis, TGA/DSC, resistivity measurements, adhesion testing, and supplier-supported technical trials.
- Perform metrology, characterization, reliability testing, and failure analysis using microscopy, profilometry, SEM/EDS, cross-sectioning, die-shear/pull testing, electrical measurements, thermal cycling, and temperature/humidity stress testing.
- Independently operate, troubleshoot, and maintain cleanroom and laboratory equipment, including mask aligners, spin coaters, wet benches, plasma etchers, PVD sputtering systems, electroplating equipment, and bonding tools.
- Develop and maintain experimental run sheets, process recipes, SOPs,



test procedures, inspection records, data summaries, and technical reports supporting repeatable processes and customer deliverables.
- Collaborate with NFR engineering teams, customer researchers, equipment vendors, materials suppliers, and external fabrication partners to resolve technical challenges, improve process capabilities, and complete project milestones according to agreed timelines and specifications.

Expected Outputs and Performance Indicators

- First 30 Days: Reproduce the established baseline packaging process, demonstrate independent equipment and process execution, and assume ownership of experimental run sheets, SOPs, and outstanding DOE activities.
- By Month 3: Deliver quantified electrical yield, interconnect resistance, and bond-strength data using established test vehicles, supported by documented characterization and statistical analysis.
- By Month 6: Complete initial reliability evaluations, demonstrate a first pitch-scaling process iteration, and establish documented, repeatable process conditions.
- Demonstrate measurable improvements in process repeatability, electrical yield, bond integrity, material performance, and manufacturing feasibility.
- Deliver accurate experimental records, test data, process recipes, validation summaries, technical reports, and customer documentation packages.
- Identify and resolve process limitations, equipment constraints, material incompatibilities, and reliability concerns through documented engineering analysis.
- Support timely completion of customer product deliverables, prototypes, technical outputs, test results, and project milestones in accordance with agreed timeline

📌 Senior Process Engineer (Redmond)
🏢 Noisefigure Research
📍 Redmond