Touchdown Labs is seeking an experienced Deposition, Metallization & Plating Engineer to define material stacks and evaluate deposition routes for chip packages in a manufacturing context.
You will coordinate measurements, compare routes, and ensure reliability criteria are met across the defined workpiece range, collaborating with qualified owners and suppliers. Early work focuses on specification and plan development, with hands-on trials at authorized facilities.
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📌 Deposition & Metallization Engineer - Advanced Packaging (North Burnett Regional)
🏢 Touchdown Labs
📍 North Burnett Regional
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