Job Description
Open role Deposition, Metallization & Plating Engineer Why this work matters n
Touchdown is engineering the manufacturing behind storage, memory systems, and other chips. This role helps turn a buyer's physical result into a qualified process or a defensible decision to use an existing supplier. Advanced packaging is our intended first fab class; no production fab is operating today.
Overview n
You will define the material and conductor stack required by a specific device or package layer, then compare feasible deposition, seed, plating, and finish routes. A process choice has to survive both inline metrology and downstream electrical and reliability tests. Early work is a specification and controlled comparison with qualified suppliers; hands-on trials require approved equipment, chemistry, and facilities.
What you will own n
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Specify films and conductors, adhesion, seed/plating or other selected routes, uniformity, contamination, and electrical effects.
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Specify film stack, conductor geometry, adhesion, sheet resistance, uniformity, and contamination limits.
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Compare deposition, seed, plating, anneal, and finish options for a named package layer.
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Coordinate chemical, electrical, thermal, and reliability measurements with qualified owners.
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Connect material specifications and tool settings to electrical resistance, interface integrity, and package reliability.
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Define control samples, measurement methods, and corrective actions for film variation or plating defects.
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Technical territory n
Thin films and surface preparation; physical or chemical deposition where appropriate; seed layers, electroplating, metallization, adhesion, sheet resistance, thickness uniformity, contamination, thermal exposure, corrosion, tool controls, and waste handling.
Representative outputs n
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A layer-specific process and measurement plan with thickness, adhesion, resistance, defects, and safety limits.
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A layer-specific recipe and incoming-material specification with process window.
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A measurement and reliability matrix, including failure and stop criteria.
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A supplier and process comparison with material inputs, tool capability, measurement uncertainty, environmental controls, and accepted-positive cost.
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What success looks like n
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Film or conductor variation stays inside the customer CTQ budget.
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A failed layer can be traced to material, tool, recipe, or measurement.
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The selected stack meets product electrical and reliability limits across the claimed workpiece range.
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Any process drift can be detected, held, and traced before affected material moves downstream.
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What you bring n
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Thin films, PVD/CVD, plating or related metallization, equipment controls, and reliability testing.
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Hands-on thin-film or plating process development and qualification.
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Can interpret thickness maps, electrical resistance, adhesion, and defect data.
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Understands equipment controls, chemistry hazards, and cross-process contamination.
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Experience with process qualification, film or plating metrology, and defect investigation.
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Understanding of chemical safety, equipment controls, and the effect of upstream preparation on film performance.
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Helpful experience n
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RDL copper and barrier/seed stacks
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PVD, CVD, ALD, electroplating, or CMP interfaces
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Redistribution layers and package interconnects
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Surface analysis and failure analysis
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Supplier-to-site process transfer
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How the role works n
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Applications are open; the exact work location, arrangement, compensation, and start date will be discussed during hiring.
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Early work can produce engineering plans and partner comparisons. Hands-on work begins only at qualified, authorized facilities.
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You will work with process, equipment, quality, test, customer, and supplier owners as the scope requires.
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📌 Deposition, Metallization & Plating Engineer (Queensland)
🏢 Touchdown Labs
📍 Queensland