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Deposition, Metallization & Plating Engineer

Why this work matters

Touchdown is engineering modular manufacturing for the chips and memory systems future computing needs. This role helps turn a buyer's physical result into a qualified process or a defensible decision to use an existing supplier. Advanced packaging is our intended first fab class; no production fab is operating today.

Overview

You will define the material and conductor stack required by a specific device or package layer, then compare feasible deposition, seed, plating, and finish routes. A process choice has to survive both inline metrology and downstream electrical and reliability tests. Early work is a specification and controlled comparison with qualified suppliers; hands-on trials require approved equipment, chemistry, and facilities.

What you will own

- Specify films and conductors, adhesion, seed/plating or other selected routes, uniformity, contamination, and electrical effects.
- Specify film stack, conductor geometry, adhesion, sheet resistance, uniformity, and contamination limits.
- Compare deposition, seed, plating, anneal, and finish options for a named package layer.
- Coordinate chemical, electrical, thermal, and reliability measurements with qualified owners.
- Connect material specifications and tool settings to electrical resistance, interface integrity, and package reliability.
- Define control samples, measurement methods, and corrective actions for film variation or plating defects.

Technical territory Thin films and surface preparation; physical or chemical deposition where appropriate; seed layers, electroplating, metallization, adhesion, sheet resistance, thickness uniformity, contamination, thermal exposure, corrosion, tool controls, and waste handling.

Representative outputs

- A layer-specific process and measurement plan with thickness, adhesion, resistance, defects, and safety limits.




- A layer-specific recipe and incoming-material specification with process window.
- A measurement and reliability matrix, including failure and stop criteria.
- A supplier and process comparison with material inputs, tool capability, measurement uncertainty, environmental controls, and accepted-valuable cost.

What success looks like
- Film or conductor variation stays inside the customer CTQ budget.
- A failed layer can be traced to material, tool, recipe, or measurement.
- The selected stack meets product electrical and reliability limits across the claimed workpiece range.
- Any process drift can be detected, held, and traced before affected material moves downstream.

What you bring
- Thin films, PVD/CVD, plating or related metallization, equipment controls, and reliability testing.
- Hands-on thin-film or plating process development and qualification.
- Can interpret thickness maps, electrical resistance, adhesion, and defect data.
- Understands equipment controls, chemistry hazards, and cross-process contamination.
- Experience with process qualification, film or plating metrology, and defect investigation.
- Understanding of chemical safety, equipment controls, and the effect of upstream preparation on film performance.

Helpful experience

- RDL copper and barrier/seed stacks
- PVD, CVD, ALD, electroplating, or CMP interfaces
- Redistribution layers and package interconnects
- Surface analysis and failure analysis
- Supplier-to-site process transfer

How the role works
- Applications are open; the exact work location, arrangement, compensation, and start date will be discussed during hiring.
- Early work can produce engineering plans and partner comparisons.

Hands-on work begins only at qualified, authorized facilities.

- You will work with process, equipment, quality, test, customer, and supplier owners as the scope requires.

Apply for this role → Show a real process, tool, workpiece, or product decision you owned, the measurements behind it, and what another team could reproduce.

📌 Deposition, Metallization & Plating Engineer (The Limits)
🏢 Touchdown Labs
📍 The Limits