Job Description
Syenta is seeking an experienced engineer to lead in-house design of advanced substrate IC packages and interposers. You will craft layouts enabling next-generation packaging architectures with high-density, multi-layer designs for chip-to-chip integration and fabrication readiness.
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The role sits at the intersection of electrical, thermal, and mechanical design, working with global teams to ensure manufacturability and performance. Hybrid work from Sydney is offered.
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📌 Senior Substrate Ic & Interposer Design Engineer (New South Wales)
🏢 Syenta
📍 New South Wales
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