Job Description
About Syenta
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Syenta is pioneering a new era in semiconductor manufacturing with our groundbreaking Localised Electrochemical Metallization (LEM) technology. Our platform enables advanced packaging by combining patterning and metallisation into a single tool. We achieve high-speed, high-resolution metallisation at significantly lower cost and energy use, while minimizing emissions and waste.
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Founded in Australia, we are building a world‐class team tackling some of the toughest challenges in semiconductor manufacturing. Our collaborative, people‐first culture empowers individuals to take ownership, move quickly, and deliver meaningful impact.
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About The Role
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This role is a critical addition to Syenta's technical capabilities, enabling in‐house design of advanced substrate IC packages and multi‐layered interposers. You will play a foundational role in developing designs that underpin next‐generation packaging architectures, including high‐performance chip‐to‐chip integration approaches.
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Working at the intersection of electrical, thermal, and mechanical design, you will lead the development of complex substrate layouts that directly enable fabrication and deployment of our platform.
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This is a highly technical, hands‐on role with immediate impact, where your work will directly unlock fabrication and influence the future direction of our technology.
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Responsibilities
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Substrate & Interposer Design
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Design large (>50mm), complex multi‐layer substrate interposers with high pin counts and dense routing requirements
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Develop high‐speed signal routing solutions capable of supporting >50GHz performance while minimizing signal integrity issues such as loss and crosstalk
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Ensure robust signal integrity (SI) and power integrity (PI) across all designs
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Optimize designs for thermal performance and reliability
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Design Validation & Documentation
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Perform DRC (Design Rule Check) and LVS (Layout vs. Schematic) verification for all substrate designs
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Develop and maintain detailed design documentation, specifications, and reusable guidelines for future interposer and substrate development
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Cross‐Functional Collaboration
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Work closely with global, cross‐functional teams across engineering disciplines to ensure design feasibility, manufacturability, and performance
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Partner with process, materials, and hardware teams to align design with fabrication capabilities and constraints
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Technical Leadership & Development
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Contribute to the establishment of internal best practices for substrate and interposer design
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Provide expertise in advanced packaging design, helping build this capability within Syenta
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Requirements
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Bachelor's or Master's degree in Electrical Engineering, Computer Engineering, or a related field
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5+ years of experience in substrate IC package design for high‐performance processors or accelerators
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Extensive experience designing large-format substrate packages (>50mm) with complex, high‐density layouts
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Deep expertise in high‐speed signal design, including mitigation of crosstalk, reflections, and impedance mismatches
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Advanced proficiency in Allegro Package Designer (constraint management, routing, and design verification)
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Strong understanding of SI/PI principles and their application to package‐level design
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Solid foundational knowledge across electrical, materials, thermal, and/or mechanical engineering disciplines
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Working knowledge of substrate manufacturing processes, design rules, and material properties
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Strong analytical and problem‐solving skills, with the ability to operate effectively in a fast‐paced, cross‐functional setting
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Preferred Qualifications
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Familiarity with Valor CAM350 or Calibre for package design reviews
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Experience designing for advanced packaging architectures (e.g. multi‐chip modules, interposers, or similar high‐density systems)
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Experience working in high‐growth or startup environments
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Why Choose Syenta?
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We're passionate about building a diverse, people‐first company. We believe that our culture of collaboration and mutual respect fuels the kind of innovation that can redefine an industry.
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What We Offer
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Salary Range: $130,000 – $180,000 + ESOP
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Hybrid work environment (Sydney-based)
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Flexible leave policies and strong work‐life balance
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Opportunity to work closely with leadership and shape company direction
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Professional growth in a high‐impact, fast‐growing deep‐tech startup
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📌 Substrate Ic Package Design Engineer - Remote (New South Wales)
🏢 Syenta
📍 New South Wales