Syenta is seeking an experienced engineer to lead in-house design of advanced substrate IC packages and interposers. You will craft layouts enabling next-generation packaging architectures with high-density, multi-layer designs for chip-to-chip integration and fabrication readiness.
The role sits at the intersection of electrical, thermal, and mechanical design, working with global teams to ensure manufacturability and performance. Hybrid work from Sydney is offered.
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📌 Senior Substrate Ic & Interposer Design Engineer City Of Sydney
🏢 Syenta
📍 City of Sydney
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